Advanced Semiconductor Packaging
Course Description (1 day): This course addresses IC packaging, assembly, and chip/substrate interconnections. It stresses the impact of the IC and end product requirements, i.e., “smaller, better, cheaper” and their influence on the manufacturing processes. Topics include all types of packages including ball grid arrays, flip chip, fanout, leadframe, stacked die, stacked packages, System-in-Package, and chip scale packages, and assembly technologies – Chip & Wire, Tape Automated Bonding, and Flip Chip. The growing importance of packaging as a way to deliver high integration and performance in today's products through heterogeneous integration of chiplets or 3D hybrid bonding will be discussed.
Target Audience:
This course is suitable for anyone seeking a better understanding of the assembly and packaging of semiconductor devices.
Learning Objectives:
Identify package types and applications
Determine which package type is best for an application
Explain common process issues and defects caused by packaging and strategies for prevention and mitigation
Identify the major packaging service providers
Describe emerging IC packaging technologies and trends in semiconductor manufacturing.Type your paragraph here.