Fan Out Packaging ( 1 day)
Course Outline.
Definition and Advantages
What is Fan-Out Packaging?
Chip First vs. Chip Last
Die Up vs. Die Down
Fan-Out vs. Embedded Die
Advantages of Fan-Out Packaging
History
Infineon / Freescale / Others
Simpler, Single-Chip Fan-Out Packages
High Volume Production Examples
Design
Process Flow
Equipment Materials
Advanced Fan-Out Packaging
Multi-chip
Package-on-Package (PoP)
Apple Application Processor in TSMC InFO-PoP Package – deep dive
Bridge Chips Through-mold Interconnects
Adaptive Patterning
Wafer vs. Panel Processing
Landscape
OSAT Providers
Patents
/ IP
Summary / Conclusion
Price $995 per Attendee
On-site $8900 for up to 20 attendees