This 1 day course  is designed to provide a sound foundation in the fundamentals of chemical mechanical planarization (CMP) used today in integrated circuit fabrication. Topics include CMP overview, CMP tools, CMP consumables, fundamentals of process control, dielectric CMP, CMP of conducting materials and post CMP cleaning.

Topics include

Overview

Generalized schematics of CMP and Post-CMP Clean
Current CMP environment
Evolution of CMP
The CMP Module
The CMP Infrastructure

Polishing equipment trends
Polishing process issues
Consumables (pads & slurries)

Quality issues
Factors affecting productivity
Critical pad and slurry parameters

Applications:
dielectric CMP
CMP of conducting materials

Copper CMP
Tungsten CMP
Cobalt CMP
Post CMP cleaning
Defect issues using CMP

Environmental Health and Safety (EHS) considerations
Slurry fluid dynamics
Slurry re-use
Post-CMP cleaning

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Process engineers, R&M technicians, equipment engineers, product engineers, tool application and sales engineers