Course Overview
CMOS, BiCMOS, and Bipolar Process Integration - a 2-day course, presents the physics behind mixed-signal integrated circuit operation and processing technologies. We emphasize current issues related to designing and manufacturing next-generation devices.
What the Course Covers
Basic Device Operation
- Will learn the fundamentals of transistor operation
- Major applications for CMOS (Complimentary Metal Oxide Semiconductor)
- BiCMOS (Bipolar CMOS)
- FinFet devices
Fabrication Technologies
- Fundamental manufacturing technologies
- Typical CMOS, BiCMOS, Bipolar FinFet process flows
- Process flows used to guide IC fabrication
Current Issues in Process Integration
- Three parameters that constrain device operation
- How new materials are influencing the fabrication process
- Potentially causing future manufacturing problems
- Image of new materials, yield, scaling, and process integration
- Down to 3 nm node
Detailed Topics
Introduction and Isolation Techniques
- Introduction and Basic Definitions
- Junction and Oxide Isolation
- Device isolation, Isolation technique
- Junction & oxide isolation, Emitter isolation
- Isolation length
LOCOS and Trench Isolation
- LOCOS: Definition, Basic concepts, Steps of fabricating LOCOS
- Trench isolation: Definition of shallow trench
- Definition of deep trench isolation
- Comparison of STI & LOCOS
- Shallow trench isolation, CMP for STI
- Deep trench isolation, Fabrication process of deep trench isolation
Silicon on Insulator (SOI) Techniques
- Definition of SOI
- Industrial need of SOI
- SOI techniques, Methods of SOI isolation
- Dielectric isolation, Wafer bonding
Metallization and Planarization
- Metallization: Definition, Multilevel metallization
- Interconnection material, Metal requirement
- Junction spiking, Stress migration, Electromigration
- Planarization: Definition, Process of planarization, Working principle
IC Technologies
- NMOS IC technology: Definition & basic concepts, Fabrication process, Advantages/Disadvantages
- CMOS IC technology: Basic concepts, Fabrication process, Advantages/Disadvantages
- Bipolar IC technology: Basic concepts, Steps of fabrication, Advantages and limitations
- FINFET & GAA IC technology: Basic Concepts, Steps of Fabrication, Advantages and Limitations
Fault Diagnosis & Characterization
- Basic concepts
- Combinational fault diagnosis methods
- Sequential fault diagnosis methods
- Characterization techniques
Who Should Attend
Anyone wanting an understanding of semiconductor process integration.