Semiconductor Training Courses

Training covering 3D stacking, TSV (Through Silicon Via), and TGV technologies for advanced packaging.

Advanced course on copper interconnects, covering damascene processes, barrier layers, CMP, and reliability challenges.

Comprehensive course covering IC packaging, assembly, interconnections, ball grid arrays, flip chip, fanout, stacking die, chip scale packages, and emerging 3D technologies.

Training on reliability practices, failure analysis, Weibull analysis, and FMEA for manufacturing equipment.

Explore how Artificial Intelligence is reshaping the supply chain, analyzing technology integration, risk factors, and the evolving competitive landscape.

2-day design course covering Standard Cell, Gate Arrays, FPGAs, DFT methods, and testing procedures.

Comprehensive course covering electronics fundamentals, troubleshooting techniques, testing equipment, and hands-on circuit building for semiconductor professionals.

Fundamentals of CMOS logic design covering transistor operation, logic gates, timing analysis, and power optimization.

Deep sub-micron CMOS integration covering advanced lithography, etching, deposition, and integration challenges.

3-day training covering Design of Experiments (DOE) for process optimization and characterization.

3-day course on digital test tech covering ATE systems, DC/AC/functional testing, and design-for-testability.

Master systematic approaches to troubleshooting, covering diagnostics, tools, and problem-solving.

Overview of EUV lithography, covering system architecture, mask tech, and process integration for advanced nodes.

1-day course covering fan-out packaging definition, advantages, chip first vs chip last, and other advanced tech.

2-day training on flip chip technology, including solder bumping, copper pillar, and underfill processes.

Comprehensive course covering Atomic Layer Deposition (ALD), Atomic Layer Etching (ALE), and precursor chemistries for semiconductor manufacturing.

1-day training on CMP fundamentals, polishing equipment, consumables (slurries/pads), and process control.

2-day training covering ion implantation fundamentals, equipment, process control, and troubleshooting.

Introductory course covering MEMS fabrication techniques, applications, photolithography, etching, deposition, metrology, and packaging. No prior knowledge required.

Complete overview of integrated circuit design and fabrication processes from concept to production.

2-day CMOS layout course covering topological processes, floor planning, transistor techniques, and IC dev flow.

IC packaging, assembly, and interconnections covering BGA, CSP, chip & wire, TAB, flip chip, HDI substrates, and 3D packaging technologies.

Professional training in introduction to statistical process control (SPC) for semiconductor industry professionals.

Verilog HDL training covering hardware description languages, SystemVerilog, data types, design simulation, synthesis, and FPGA/ASIC development.

MFC training covering gas flow control, calibration, maintenance, installation, and best practices for precise semiconductor process gas delivery.

3-day course on mixed-signal and analog testing, covering test economics, defect-oriented testing, and signal generation.

3-day training covering VLSI device physics, scaling effects, hot-carrier degradation, DIBL, and characterization.

Comprehensive overview of manufacturing from wafer fabrication to final testing, including clean room operations.

1-day course on intellectual property fundamentals including trademarks, copyrights, trade secrets, and patents.

Understand PFAS chemicals in semiconductor processes, regulations, health impacts, and alternative solutions.

Comprehensive course covering plasma assisted phenomena, reactive ion etching (RIE) processes, ALE methods, and plasma diagnostics for semiconductor manufacturing.

1-day course on RF plasma fundamentals and how plasma parameters influence etch, CVD, and PVD processes.

Training in RF measurement instrumentation including network analyzers, Z’scan RF sensors, and Picoscopes.

Advanced concepts in RF power delivery for plasma systems, including generators and matching networks.

Strategies for equipment suppliers to drive high reliability, minimize preventive maintenance, and increase profit.

Memory design course covering SRAM, DRAM, Flash, array architecture, peripheral circuits, testing, power management, and memory technologies.

Explore principles of semiconductor optoelectronics, photonic devices, and their applications in modern technology.

Course on sustainability, health hazards, and strategies for reclaiming resources in semiconductor manufacturing.

Fiber optics communications training covering optical principles, fiber types, connectors, testing methods, and network applications.

Comprehensive introduction covering design, fabrication, business models, and industry overview.

Practical knowledge of vacuum systems operation, diagnostics, pumps, gauges, RGA, and leak detection.

Comprehensive course covering wet etch & clean, electroplating, and CMP processes for IC manufacturing. Includes surface conditioning and cleaning techniques.

Advanced surface analysis techniques using XPS for materials characterization and failure analysis.

Comprehensive yield management strategies and statistical analysis for manufacturing optimization.