Plasma Physics and Chemistry

Professional semiconductor training with 46+ years of industry expertise

Course Overview

The purpose of this course is to teach attendees what a plasma is and does, what it is used for, and how plasma parameters can influence the outcomes of etch, CVD, and PVD processes. It provides the essential vocabulary and basic understanding of RF plasma required to navigate modern semiconductor manufacturing operations.

What the Course Covers

  • Plasma physics fundamentals and properties
  • Reactive ion etching (RIE) processes and mechanics
  • Atomic layer etching (ALE) techniques
  • Impact of plasma variables on CVD and PVD outcomes
  • Process optimization, tuning, and control
  • Equipment design, operation, and vacuum systems
  • Safety protocols and troubleshooting procedures

Who Should Attend

This course is highly recommended for operators, process managers, engineers, technicians, plant managers, and supply-chain managers who require a working understanding and common vocabulary of RF plasma systems.

Prerequisites

Attendees should have a good, working knowledge of vacuum systems for process tools before taking this course.

Course Format & Size

This is a one-day class (up to 20 attendees) consisting mostly of detailed lectures, complemented by a 45-60 minute hands-on lab that will draw three volunteers from the class for practical demonstration.

Expert Instructors

Learn directly from industry veterans with 20+ years of hands-on experience in specialized plasma topics and advanced semiconductor technology.

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Group discounts available

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Duration
1 Day
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Audience
Operators, Engineers
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Format
Lecture & Lab
Level
Intermediate
🎓
Certificate
Included
📚
Class Size
Up to 20

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