Course Overview
This 1-day course addresses IC packaging, assembly, and package/substrate interconnections. It stresses the impact of the IC and end product requirements, i.e., "smaller, better, cheaper" and their influence on the manufacturing processes. The course covers area packaging technologies, assembly methods, and emerging packaging solutions including 3D and stacked die technologies.
Course Topics
IC Packaging Fundamentals
- Introduction to IC packaging concepts
- Package types and classifications
- Impact of IC and end product requirements
- "Smaller, better, cheaper" design philosophy
- Package/substrate interconnections
Area Packaging Technologies
- Ball Grid Arrays (BGA)
- Chip Scale Packages (CSP)
- Package design considerations
- Thermal and electrical performance
- Reliability considerations
Assembly Technologies
- Chip & Wire bonding technology
- Tape Automated Bonding (TAB)
- Flip Chip assembly
- Assembly process considerations
- Quality and reliability in assembly
High Density Interconnect (HDI) Substrates
- HDI substrate manufacturing technologies
- HDI Printed Wiring Boards
- Via formation and metallization
- Multi-layer substrate construction
- Design rules and constraints
Emerging Technologies
- 3D packaging technologies
- Stacked die packages
- Through Silicon Via (TSV)
- System-in-Package (SiP)
- Advanced packaging trends
Packaging Reliability
- Reliability testing methods
- Failure modes and analysis
- Environmental stress testing
- Quality assurance in packaging
Who Should Attend
Anyone wanting to understand assembly and packaging of ICs.