Fundamentals of Chemical Mechanical Planarization (CMP)

Professional semiconductor training with 46+ years of industry expertise

Course Overview

This 1-day course provides a sound foundation in the fundamentals of chemical mechanical planarization (CMP) used in integrated circuit fabrication. Topics include CMP overview, CMP tools, CMP consumables, process control, dielectric CMP, CMP of conducting materials and post CMP cleaning.

Course Topics

CMP Overview

  • Generalized schematics of CMP and Post-CMP Clean
  • Current CMP environment and evolution
  • The CMP Module and Infrastructure

Equipment and Process

  • Polishing equipment trends and process issues
  • Consumables (pads & slurries)
  • Quality issues and productivity factors
  • Critical pad and slurry parameters

CMP Applications

  • Dielectric CMP applications
  • CMP of conducting materials (Copper, Tungsten, Cobalt)
  • Post CMP cleaning and defect issues
  • Environmental Health and Safety considerations

Who Should Attend

Process engineers, R&M technicians, equipment engineers, product engineers, tool application and sales engineers.

Ready to Register?

$9,900 USD

For up to 14 students (1 Day)

Register Now
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Duration
1 Day
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Format
On-site Training

Need More Information?

Phone: 636-343-1333

Email: heather@pti-inc.com